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Automatic cleaning equipment is widely used in the field of integrated circuit, advanced packaging in the field of photoresist removal process. Compared with the traditional glue-removing equipment, the degree of automation is higher, using modular design, can be based on customer customized process production needs, from design and development, assembly, testing, equipment installation to after-sales service.

The main advantage： 1.Self-developed intelligent and accurate transmission control system 2.Fully Automatic Integrated Chemical Solution Supply System (CDS) 3.The liquid overflow design reduces the dosage of single liquid and reduces the use cost 4.The rate of wafer surface glue removing is 100% 5.Equipment Through-Put production capacity of 200 tablets per hour (dual TANK) 6.The optional unit modules correspond to different cleaning and removal requirements 7.The liquid tank is designed with double groove body, which can achieve accurate temperature control 8.Independent control of waste liquid exhaust, effectively protect the personnel operation

Integrated circuit field: wafer cleaning   Advanced packaging field: TSV etching glue removal process, UBM / RDL glue removal process