大学生一级毛片免费看**_别进的太深受不了太大了_国产精品视频一区二区三区_欧美特黄一级高清免费的香蕉

Welcome to Sucess (Jiangsu) Semiconductor Equipment Technology Co., Ltd. official website

SERVICE HOTLINE 139 6265 8938

TGV plating equipment
TGV plating equipment
Technical specification:
wafer size:6寸  8寸  12寸
Max board size: 510 x 515
aspect ratio:1:1-20:1
backing material: Glass, quartz
filling material:Cu
glass thickness:100um -800um
Minthrough hole diameter:10um
Hole spacing/diameter:2:1  
Features
-Cation exchange membranes can reduce the use of additives -Continuous filtration of chemical components -Dry in dry out, low maintenance cost -Custom seal range -High working efficiency -Accurate and consistent flow control -Extremely uniform site profile
Application
Glass through hole
Previous:
No data
Under:
No data
LINKS: Trough Cleaning MachineTrough Type Remover

Copyright 2022 Sucess (Jiangsu) Semiconductor Equipment Technology Co., Ltd. All Right Reserved.